10th International Conference on Mechatronics Engineering

08 - 09 September 2026 • Kulliyyah of Engineering, IIUM, Kuala Lumpur
The 10th International Conference on Mechatronics Engineering (ICOM 2026), which will be held in a dynamic HYBRID mode from 8-9 September 2026, as part of the IIUM Engineering Congress 2026.
 
This conference provides a prestigious platform for scholars, students, engineers, and scientists to showcase their latest research and breakthroughs in mechatronics engineering and technologies. Attendees will have the unique opportunity to engage with distinguished keynote and invited speakers from reputable universities in Malaysia and around the globe.
 

Conference theme:

“Advanced Mechatronics: Shaping Intelligent Machines and Systems for the Future”

 
Prospective authors are invited to submit a full paper (4-8 pages) describing their original work.
All accepted & presented papers will be submitted to IEEE for possible inclusion in IEEE Xplore (Scopus-indexed).

Conference Fee

International
If you are using the FlyWire payment system, please enter
the indicated equivalent amount in Malaysia Ringgit
Online
Presenting (First Paper)
USD 200 (RM900)
Additional Paper
(Same presenter)
USD 100 (RM450)
Non-Presenting
USD 50 (RM225)
IEEE Member
USD 180 (RM810)
IEEE RAS Member
USD 160 (RM720)
Physical
Presenting (First Paper)
USD 300 (RM1,350)
Additional Paper
(Same presenter)
USD 100 (RM450)
Non-Presenting
USD 100 (RM450)
IEEE Member
USD 280 (RM1,260)
IEEE RAS Member
USD 250 (RM1,125)
Local
All payments in Malaysian Ringgit

Online
Presenting (First Paper)
RM 700
Additional Paper
(Same presenter)
RM 350
Non-Presenting
RM 100
Non-Presenting
RM 100
Physical
Presenting (First Paper)
RM 975
Additional Paper
(Same presenter)
RM 350
Non-Presenting
RM 300
IEEE Member
RM 925
IEEE RAS Member
RM 875

Award for Best Paper for each track Paper overall Presenter |

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